Semiconductor Assembly and Packaging Services, Ayutthaya Thailand - Hana Group

Semiconductor facility-Ayutthaya


Hana Semiconductor (Ayutthaya) Co., Ltd. established in 1997 specializes in the IC assembly and test of low to medium pin count IC’s. We offer state of the art assembly processes (including Copper Wire, Chip on Lead, Multi-Die, Stacked Die, Clear Molding etc.) and test solutions. Our “leadless” package size starts from a 2 pin 0.6 x 0.3 mm to our popular package size of 40 pin 12x12 mm. Our leaded packages starts from our SOT963 with foot print of 1x1 mm to standard 24L SOIC.

Besides standard packages, we also work closely with our customers to design and develop custom package solutions to address their specific needs. We provide custom package solutions for the MEMS, SENSORS, SIP (System in Package) and Hybrids/SMT, Multi-chip Modules, Isolation/Optocouplers, RFID/HOA, Optoelectronics and Clear Optical packages. Total installed capacity within Hana for IC packaging is ~ 20 million units per day and 80% of this is tested at Hana.

HANA Semiconductor (Ayutthaya) Co.,Ltd. is ISO 9001, IATF 16949, ISO 14001, ISO 45001, ANSI/ESD S20.20, ISO/IEC 27001 and ISO13485 certified. The products are RoHS compliance.

Coupled with on-going training programs initiated to enhance technical skills and TQM (Total Quality Management) techniques, our factory personnel have attained an awareness and maturity to compete aggressively in today's competitive environment.

Hana Ayutthaya presently provides manufacturing services for the following products:

  • IC assembly and Final test
  • Wafer Test
  • 12 “ Wafer capability
  • Die Sort Visual
  • Soft solder die bonder
  • Ag Wire, Cu Wire, Cu Clip, Al Ribbon bonding
  • Al Heavy wedge bonding
  • Flipchip with Cu pillar bump
  • Auto Visual Inspection
  • TO Can
  • Optical Sensors technology
  • Proximity Sensor
  • UV Sensor
  • Automotive Sensor
  • MEMs Sensor
  • Smart card chips
  • Analog / Linear Devices test
  • Logic and Memory Devices test
  • Mixed-Signal Devices test
  • Power MOSFET and Transistor (Discrete) test
  • Opto-Coupler Devices test and High Voltage test
  • ASIC (Application Specific IC) test
  • MEMS, SENSORS and SIP test
  • RF Test

Please contact us at for more details and we look forward to working with you and providing you state of the art IC Assembly and Test solutions to service your needs.

PDIP : Plastic DUAL IN Line Package
SOIC : Small Outline integrated Circuit Package
MSOP : Mini Small Outline Package
VSOP : Very Small Outline Package
SC : Small Outline Transistor
SOD : Small Outline Diode Package
SOT : Small Outline Transistor
DFN/QFN : Dual/Quad Flat No Lead Package
LGA : Land Grid Array Package
ODFN/OQFN : Optical DUAL/Quad Flat Non Lead

Certification Certification Body Certificate No. Original Certification Date
ISO 9001:2015 SGS TH21/14373 July 2006
IATF 16949:2016 SGS TH06/3318
June 2018
ISO 14001:2015 BVQI TH016510 June 2012  
ISO 45001:2018 BVQI TH017597 27 September 2021
ANSI/ESD S20.20:2014 SGS TH18/11154 Aug 2018
ISO/IEC 27001:2013 BVQI IND19.6270/U Sep 2019  
ISO13485:2016 SGS TH21/14457 Oct 2021

Hana Semiconductor (Ayutthaya) Co., Ltd.

Hi-Tech Industrial Estate Authority of Thailand
100 Moo 1, T. Baan-Len, A. Bang Pa-In KM. 59
Asia Road, Ayutthaya 13160, Thailand

Tel: +66 (35) 729 300 (Auto 10 lines)
  Tel: +66 (35) 350 803 , 350 970-2
Fax: +66 (35) 350 805-6

Sales & Marketing Enquiry :


USA/ Europe/ Other Countries:

Sanjay Mitra

Phone: (408) 452-7474
This website uses cookies to provide you with a best browsing experience. By using this website you consent to our use of cookies and Privacy Policy. Accept