Integrated Circuit and Electronics Assembly Services -China -Hana Group

                  
Automated electronic assembly equipment

Electronics Assembly and Semiconductors Packaging




Hana Microelectronics (Jiaxing) Co., Ltd. is a manufacturing factory located at Jiaxing City, Zhejiang Province, China. The factory space has approximately 91,551 square meters and operated since 2005. The company manufactures electronic products such as IC Assembly and Test, LED, IGBT and PCBA products. The products are covering across multiple products portfolio such as Automotive, Medical, Industrial, Telecommunication, Consumer, LED, RFID and etc.



Employing over 1,400 people, Hana Jiaxing is equipped with fully automated machineries for Integrated Circuit (IC) Assembly and Test, Chip-On-Board (COB), Chip-In-Board (CIB), Chip-On-Flex, Surface-Mount (SMT), Micro-Coil Winding, Printed Circuit Board Assembly (PCBA), Opto Electronics Assembly, Box Built Product Assembly, Hybrid Module Assembly, RFID Card Lamination services and IGBT Power Module.



Hana Microelectronics (Jiaxing) Co., Ltd.is ISO 9001, IATF16949, ISO13485, ISO14001, OHSAS18001 and IECQ QC 080000 certified. More than 95% of the products are ROHS compliance.




Electronic Assembly Services

  • IC Assembly & Test
  • LED Assembly & Test
  • SMT assembly
  • COB & CIB assembly
  • Flip Chip
  • Coil winding
  • Card Lamination
  • Complete box build

Electronic Assembly Capabilities

Hana Microelectronics utilizes state of the art technology to support its electronic assembly capabilities. Our Electronic Assembly Capabilities are constantly being upgraded. For more specific details on capabilities please contact our customer representative.
SMT Process
  • Minimum Component: 01005
  • Micro BGA & CSP attachment
  • BGA Ball Build and BGA rework
  • QFP attachment
  • Convention reflow: Air or N2 option (Pb & Green)
  • Automated Optical Inspection: In Line SPI and Post-Reflow AOI
Flip Chip on Board/Flex
  • Solder Bumped
  • Under-fill: Optional
Chip On Board
  • Die Attach: Conductive and Non-conductive
  • Wire Bond
  • Glob Top: UV epoxy, silicone epoxy, black & transparent epoxy, Dam & Fill
Printed Circuit Board Assembly Processes
  • Ultrasonic welding of plastic housing
  • Pad Printing
  • Coil winding
  • Spot Welding
  • Hot Bar
  • CO2 laser cut
  • Wave Soldering: Dual Wave
  • Lamination process: Using thermo-set, thermo-plastics or pressure set adhesive
  • Machine Shop: Lathe, Milling, Drill, Grinding (Tooling and fixture done internally)

IC Packages


Leaded Packages

Package


SC70

SC82

SOT23

TSOT23

MSOP

TO263

TO263T

TO252

TO220

Lead count available


3,5,6

4

3,5,6,8

3,5,6

8,10

2,3,4,5

3,5

2,3,4,5

4


Leadless Packages

Package

DFN

DFN

DFN

DFN

DFN

DFN

DFN

DFN

DFN

DFN

DFN

DFN

DFN

DFN

DFN

DFN

DFN

DFN

DFN

Body Width
Dual flat no-Leads

0.6X1.0

1.4X1.4

1.45X1.0

1.5X1.5

2.0X1.8

2.0X2.0

2.0X3.0

2.5X1.0

2.5X4.0

3.0X2.0

3.0X3.0

3.5X1.35

3.5X2.5

3.5X4.5

4.0X4.0

4.0X6.0

5.0X5.0

5.0X7.0

6.0X6.0

Pin count available

2

6

6

6,8

6

4,6,8

8,10

10

12

14

10,12

14

14

8

8

10

8

8

8



Quad flat no-leads

QFN

QFN

QFN

QFN

QFN

QFN

QFN

QFN

QFN

QFN

QFN

QFN

QFN

1.2X1.4

1.6X1.6

1.8X1.4

1.8X1.8

2.0X2.0

2.1X1.6

2.6X1.8

3.0X3.0

4.0X3.0

4.0X4.0

5.0X4.0

7.0X7.0

10.0X10.0

8

8

10

12

3,12

10

16

12,16

20

16,20,24

24

20,24,48,56

56

IC Assembly Process Capabilities

Our IC assembly capabilities include utilization of the latest advanced automation and processing equipment. We are continually upgrading and adding to our capabilities. For the latest specific IC Assembly information, please contact our technical service.
  • Wafer Back Grind
  • Wafer Backside Coating
  • Wafer Saw
  • Wafer Level Chip Scale Packaging
  • Die Attach
  • Wire Bonding
  • Encapsulation
  • Package Singulation

IC Testing Capabilities

HANA-JX provides a complete electrical testing services to our customers at Final Test of IC ranging from logic, analog, linear to signal-analog mixed device. We also offer test program development and test hardware design (load board/DUT board) on a limited scale.
  • LDO Linear, dual, high current, low noise, adjustable Regulator,
  • CMOS
  • LED Driver, PWM
  • Motor Driver, Li Cell Protector
  • MOSFET

PCBA Test Capabilities In-circuit test development

The following are the current testing capabilities for assembled printed circuit boards and assembled flexible circuits.

In Circuit Test and Development

Manufacturing Test Process Capability
In-circuit test development Programs and fixtures
Boundary scan Single device or chained devices
Test jet/connect check Vector-less opens testing
Polarity check Backwards capacitor testing
Advanced fixturing Top side probing, 30 mil pitch, etc
Flash programming FPGA, EEPROMS, FLASH, etc
AWARE Test AXI/ICT split coverage
Analog Cluster Testing Teradyne O/X
Flying probe test Low volume, prototyping

Functional Testing

Manufacturing Test Process Capability
Functional test development Fixturing, software and hardware
RF testing Wireless, RFID,HF, UHF
LED/LCD testing Light and UHF testing
SiP/Micro Module AST2000/iSmeca

Reliability Test

Manufacturing Test Process Capability
Customize Development ESS
Burn-in Burn-in oven




Hana Jiaxing presently provides manufacturing services for the following products:

           
  • RFID Readers
  • Smart Cards and RFID Tags
  • Modules for Electronic Locks
  • Touch Pads for Computer and Smart Phone
  • Computer and Data Security Devices
  • IoT (Internet-of-things) Devices
  • Medical Sensors and Devices
  • Automotive Sensors and Electronic Devices
  • Optical Sensors and Devices
  • Jump Drives and Memory Cards
  • Home Appliance and Industrial Control
  • / Display Modules

  • Wearable Devices
  • Automotive LED
  • Consumer and Industrial High Power LED
  • Wireless Radio Frequency Devices
  • Consumer and Industrial High Power LED
  • Bluetooth Low Energy Devices
  • Packaging and Test Service: Wafer Probing, WLCSP, QFN/DFN/LGA, Flip Chip, SOT/TSOT23, SC70/82, MSOP, TO, SIP, MEMS, Solar Cell and IGBT Modules























Certification Certification Body Certificate No. Original Certification Date
ISO 9001:2015 BV CNBJ314315-U April 1998
IATF 16949:2016 BV CN038585- IATF / 430177 December 2007
ISO 13485:2016 DNV 249057-2017-AQ-RGC-NA-PS February 2007
ISO 14001:2015 DNV 3148-2006-AE-RGC-RvA November 2006
ISO 45001:2018 DNV 185471-2015-ASA-RGC-RvA October 2015
IECQ QC 080000:2017 SGS-CSTC IECQ-H-SGSCN 09.0267 July 2008

Hana Microelectronics Co., Ltd. (JiaXing)

Address No. 18, Hana Road, Xin Cheng Industrial
Park, Xiu Zhou District, Jia Xing City, ZheJiang
Province, 314000

Phone: 86-573-83528000

Fax: 86-573-83528300

Sales & Marketing Enquiry :

info-request@hanaus.com

   
KY Chew (for Micro & IC business)
kychew@hanajx.com
   
Hana Microelectronics Inc (USA)

Sanjay Mitra

smitra@hanaus.com

Phone: (408) 452-7474

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