Information & Services
HANA Semiconductor (Ayutthaya) Co.,Ltd.
ELECTRONICS MANUFACTURING SERVICE (EMS) AND OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT)
Hana Semiconductor (Ayutthaya) Co., Ltd. established in 1997 specializes in the IC assembly and test of low to medium pin count IC's. We offer state of the art assembly processes (including Copper Wire, Chip on Lead, Multi-Die, Stacked Die, Clear Molding, System In Package etc.) and test solutions. Our "leadless" package size starts from a 2 pin 0.6 x 0.3 mm to our popular package size of 40 pin 12x12 mm. Our leaded packages starts from our SOT963 with foot print of 1x1 mm to standard 24L SOIC.
Besides standard packages, we also work closely with our customers to design and develop custom package solutions to address their specific needs. We provide custom package solutions for the MEMS, SENSORS, SIP (System in Package) and Hybrids/SMT, Multi-chip Modules, Isolation/Optocouplers, RFID/HOA, Optoelectronics and Clear Optical packages. Total installed capacity within Hana for IC packaging is ~ 20 million units per day and 80% of this is tested at Hana.
HANA Semiconductor (Ayutthaya) Co.,Ltd. is ISO 9001, IATF 16949, ISO 14001, ISO 45001, ANSI/ESD S20.20, ISO/IEC 27001 and ISO13485 certified. The products are RoHS compliance. Coupled with on-going training programs initiated to enhance technical skills and TQM (Total Quality Management) techniques, our factory personnel have attained an awareness and maturity to compete aggressively in today's competitive environment.
HANA Ayutthaya presently provides Electronics Manufacturing Service (EMS) and Outsourced Semiconductor Assembly and Test (OSAT) for the following products:
- IC assembly and Final test
- Wafer Test
- 12 " Wafer capability
- Die Sort Visual
- Soft solder die bonder
- Ag Wire, Cu Wire, Cu Clip, Al Ribbon bonding
- Al Heavy wedge bonding
- Flipchip with Cu pillar bump
- Auto Visual Inspection
- TO Can
- Optical Sensors technology
- Proximity Sensor
- UV Sensor
- Automotive Sensor
- MEMs Sensor
- Smart card chips
- Analog / Linear Devices test
- Logic and Memory Devices test
- Mixed-Signal Devices test
- Power MOSFET and Transistor (Discrete) test
- Opto-Coupler Devices and High Voltage
- ASIC (Application Specific IC)
- MEMS, SENSORS and SIP
- RF Test
- SMT
- Laser Dicing
- Ceramic CLCC
- Diode for RF/Microwave
- Module Assembly
- Air Cavity
