Final Assembly Capability

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Below are just a few of our Electronic Assembly capabilities. For more information, please contact one of our technical representatives.

• Wave Soldering
• Auto Selective Wave Soldering
• Pulse Heated Reflow Soldering
• Hand soldering
• Re-Soldering
• Adhesive Bonding
• Routing
• Singulation
• Laser Marking

Chip on Board (COB) Capabilities

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Below are some of our COB capabilities that are part of our Electronic Manufacturing Services. For more information regarding our technologies or capabilities, please contact one of our technical representatives.

Wafer Back Grinding

• Wafer diameter 6” & 8”
• Tape mounter
• Non contact thickness measuring

Wafer Screening

• 8 & 12 Inches water handling<
• Epoxy thickness : 1.0 , 1.5 , 2.0 mil ( Varies design )

Wafer Dicing, Inspection and Tape & Reel

• Full Automatic mc
• Dual spindle
• 2 “ Blade
• CO2 Bubble
• Dyma flow Chemical
• Non contact wafer mounting

Wafer Inspection

• Inspection method
• Bright field & Dark filed
• Multi color filter ( 5 difference )
• Material handling
• Wafer 8 inches maximum
• Automatic import and layer mapping file.

Tape & Reel for wafer film frame

• Inspection method
• 3 inspection camera
• 5S camera capability
• Material handling
• Wafer 8 inches maximum
• Output Tape & Reel
• Wafer mapping capability

Die attach

• Die size
• 6 x 6 mil – 400 x 400 mil
• Substrate handling
• W x L : 102 x 300 mm.
• Stamping & Dispensing Type
• Heater support
• DAF , B-Stage
• Electronic mapping
• Max wafer 12"
• Bridge support ( 2 Dies )

Eutectic Die Attach

• Solder composition 80Au/20Sn
• Temperature profile Programmable 320 degree Max.
• Substrate 51 x 51 mm
• Dual tool holder for Die and preform
• Ultrasonic scrub with adjustable time, frequency and amplitude
• Interchangeable heated work holder

Wire bond Process

• Wire diameter
• 0.6 – 2.0 mil
• Material Handling
• Gold , Cu , AuAg , CuPd
• Stud bump
• Substrate handling
• W X L : 92 x 300 mm.
• T : 0.2 – 0.9 mm.
• Bonding area : 80 x 56 mm. ( X x Y )

Stud Bump

• Wire diameter: 1 mil.(AW66)
• Seat Diameter:- +/-5 um
• Seat High: - +/- 4 um.

Manual Gold Wire Bonding

• Thermosonic ball/wedge bond
• Au wire: Round wire dia. 0.7-2.0 mils
• Au Ribbon size: 0.5x10 mils
• XYZ free movement
• Deep access capability

Coating process

• High machine accuracy
• Linear X-Y Servo motor
• Auto weight scale : 0.1mg minimum
• Working area 120 x 260 mm.
• Varies pump support
• Auger Pump , Linear , Jet

Marking

• Fiber laser, CO2 marking, UV laser mark, IR laser mark.
• Full automatic loading
• Black / Clear compound
• LCP , PCB , Ceramic